Low Temperature SQUID Release Large Device

5mm×5mm chip is divided into two parts of 2.5mm×5mm. On the left is the design of SQA11TES and SQB11TES, and on the right is the design of SQE11TES.Each 2.5mm×5mm design includes 1×4 dc-SQUID current amplifier, TES is connected in series, and the TES bias signal is introduced through the “+R” and “-R” pads.The "+IN“ and ”-IN“ pads are used to connect to the TES detector, and the ”+V“, ”-V“, ”+F“, and ”-F" pads are used for the bias output and feedback of each dc-SQUID current amplifier.

Parameter Details

Parameter

Numerical value

Chip size

2.5 mm×5.0 mm

Input Pad Size

500 μm×475 μm Nb film

SQUID  Bias and feedback Pad size

300 μm×200 μm Nb film

DC-SQUID configuration

First-order gradient/second-order gradient

SQUID Loop inductance

110 pH

TES bias resistor

250 μΩ

Heating resistance

100 Ω

Operating temperature

0~4.2 K

dc-SQUID Current amplifier (T=4.2K)

Device name

SQA11TES

SQB11TES

SQE11TES

unit

Critical current (2Ic)

18

18

18

 μA

Hysteresis resistance (Rn/2)

2

2

2

Ω

Shielding parameters  ql

1.1

1.1

1.1


Hysteresis parameters  qc

0.35

0.35

0.35


Voltage modulation amplitude

20

20

20


Flux voltage conversion coefficient  V2

80

80

80

μV/Φ0

Feedback mutual inductance (1/Mf)

9

8.5

45

μA/Φ0

Input mutual inductance (1/Min )

9

8.5

9.5

μA/Φ0

Tuning inductance (nH)

30

30

30

nH

Magnetic flux noise (Φ0\√Hz) (@1kHz)

2

2

2

μΦ0\√Hz